Advanced Thermal Solutions Candlestick Sensors - Temperature and Air Velocity Sensors
- Flexible, robust, base-and-stem design air velocity sensor that measures both temperature and air velocity for characterizing thermal conditions in electronic systems
- Available in 9-, 12- or 20-mm height, 1.5- or 5-meter wire length and 0-6 or 0-50 m/s velocity range
- Temperature measurement range: -20° to +120°C ±1°C
- Narrow and low profile to minimize the disturbance of the heat flow in the test domain
- Compatible with most ATS instruments including the iQ-200, ATVS-2020, ATVS-NxT, eATVS, ISD and WTC-100
The Advanced Thermal Solutions Candlestick Sensor is a flexible, robust, base-and-stem design air velocity sensor that measures both temperature and air velocity for characterizing thermal conditions in electronic systems. The Candlestick Sensor is narrow and low profile to minimize the disturbance of the heat flow in the test domain. It features a flexible, plastic-sleeved stem, which facilitates installation and repositioning during the testing process.
Air velocity and temperature sensors are calibrated for low (natural convection) and high velocity flows. They are capable of temperature measurements ranging from -20° to +120°C ±1°C. Velocity measurements range from 0 to 50 m/s (10,000 ft/min) ±2%, depending on the particular model of sensor.
The use of a single sensor to measure both temperature and velocity eliminates errors that can occur when airflow is non-isothermal. Multiple Candlestick Sensors can be easily installed to thoroughly map a system’s thermal and airflow conditions. Their robust design allows for continuous repositioning and reading.
Key Features
- Highly Accurate
- Minimal Flow Disturbance
- Single sensor measures both temperature and velocity
- Double side adhesive allows for easy mounting
- All plastic design prevents electronics shorting
- Flexible design allows for easy repositioning
- Compatible with most ATS instruments, including the iQ-200, ATVS-2020, ATVS-NxT, eATVS, ISD and WTC-100
Applications
- Component Testing
- Heat Sink Characterization
- Heat Sink Comparison
- PCB Testing
- Thermal Characterization Studies