BGA Rework Station

 
Weller WQB4000SOPS BGA Rework Station,Split-Vision,120V
Catalog: WQB4000SOPS
  • Product Height: 1.00 IN
  • Product Length: 1.00 IN
  • Product Width: 1.00 IN
  • HTS/Schedule B Number: 8515190000
  • Country of Origin: Germany
  • Shipping Height: 1.00 IN

List Price: $37,080.00

Your Price: $33,866.97

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BGA Rework Station

BGA Rework Stations are used for the manual alignment, replacement, or removal of BGA, μBGA, CSP, and other surface mount components with repeatable solder reflow profiles. BGA stands for ball grid array. It is a type of surface mount technology used for packaging integrated circuits. BGA rework stations come in a variety of sizes and styles to meet a range of needs.
 
BGA Rework Station Applications
  • Manual alignment and placement or removal of BGA, μBGA, CSP and other surface mount components with repeatable solder reflow profiles
  • Rework and repair of defective BGA components
Key Features of BGA Rework Stations to Consider
  • Gantry System
  • Board and component capacity
  • Control panel/software
  • Four Thermocouple Input Ports
  • Optics
  • CCD Video Camera
  • Rigid structure for stability and accurate component placement
  • Fine adjust with fine-threaded adjustment knobs
  • Pentium Class PC with Windows-based operating system
  • Recipe controls parameters for Preheat, Soak, Reflow, and Cool Down
  • Unlimited recipe storage
  • Advanced, automatic profiling capabilities
  • Video capture card with flat screen monitor provides clear viewing during component placement
  • "Teach" mode profiling sets the recipe times based on the input operating and target temperatures
  • Password protection prevents unauthorized use or adjustment of recipes
  • Optional Pan and Tilt mirror allows zoom in and scanning of image
This video demonstrates The Hakko FR-1418 BGA rework system. It is designed for the manual alignment and placement or removal of BGA, μBGA, CSP and other surface mount components with repeatable solder reflow profiles.
 
 

Background on Soldering Equipment

Soldering is the process of bonding two or more metal items by filling the joint with a material called solder. It differs from welding because the pieces being joined are not melted. Instead, the filler metal is melted and flowed into the joint.
 
The basic solder equipment needed is a solder iron and a soldering station. However, there are many options and accessories available to meet a variety of soldering needs. When purchasing soldering equipment, it is important to remember two things:
  • Temperature and variable control are key. These features will help improve soldering, so be sure to consider the temperature ranges and variable control when choosing a soldering station
  • Keep extra nozzles and tips on hand. These are inexpensive and consumable. It is easier and more cost effective to purchase extras in advance rather than place another order and pay for shipping in the future
Soldering equipment is used by professionals as well as hobbyists. One of the benefits of soldering is that the process is reasonably permanent but reversible. Desoldering tools are available to remove unwanted solder.
 
Soldering Equipment Applications
  • Plumbing
  • Electronics
  • Metalwork
  • Food and beverage
  • Roof flashing
  • Automotive
  • Aerospace
  • Household appliances
  • Troubleshooting, replacement, and salvage
Types of Soldering Equipment
  • BGA Rework Station. BGA rework stations are used for the manual alignment, replacement, or removal of BGA, μBGA, CSP, and other surface mount components with repeatable solder reflow profiles
  • Desoldering Equipment/Rework Stations. Desoldering is the process of removing solder. It is used to repair, replace, and salvage in a variety of applications
  • Dispensing Equipment. Dispensing equipment is used to dispense solder paste
  • Fume Extraction. Fume extraction devices are used to absorb widespread smoke and/or smoke around equipment users
  • Hot Air Guns. Hot air guns are used for efficient drying as well as heat-shrinking, thawing frozen pipes, heating liquids, bending materials, and more
  • Lead Forming Equipment. This equipment is used during the process of lead forming, which involves bending component leads so that they can be inserted into holes or surface-mounted on a circuit board
  • Nozzles. Soldering nozzles are used on hot air pencils and with rework stations. They transfer the heat to the connection point
  • Pre-Heater. Pre-heaters provide fast, efficient underside heating and reduce the possibility of thermal damage to sensitive components
  • Soldering Equipment. Soldering is the process of bonding two or more metal items by filling the joint with a material called solder. Available equipment includes soldering stations and soldering guns, irons, and pencils
  • Soldering Pots. Soldering pots are portable devices used to melt solder and for dip soldering small items as well as tinning the ends of wire leads
  • Soldering Stands. Soldering stands hold many different types of soldering irons. They make soldering and desoldering easier
  • Static Control. Static control equipment protects users and equipment from static charge
  • Tips. Soldering tips transfer the heat to the connection point. They are essential to the soldering process and come in a variety of sizes and styles to meet a range of needs
Key Features of Soldering Equipment to Consider
  • ESD-safe by design
  • Compatible with LEAD-FREE solder
  • Lockout keycard
  • UL, cUL, CSA, and/or CE electrical safety approvals
  • Durable and easy to use
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